Substrates are placed into the vacuum chamber, and are pumped down to their process pressure. Sputtering starts when a negative charge is
applied to the target material (material to be deposited), causing a plasma or glow discharge.
Positive charged gas ions generated in the plasma region are attracted to the negative biased target plate at a very high speed. This collision creates a momentum transfer and ejects atomic size particles from the target. These particles traverse the chamber and are deposited as a thin film onto the surface of the substrates.